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4 September 2025

SK Hynix installs high-NA EUV production tool

The perception of ASML’s high-NA EUV technology is getting a most welcome boost as the South Korean firm apparently prepares for insertion in high-volume manufacturing.

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Superlight declared bankrupt, restart in the works

Twente-based startup Superlight Photonics was declared bankrupt this week due to irreconcilable differences between founder Haider Zia and the shareholders about further financing.

Luxene debuts illuminated road markings with off-road electronics

Dutch startup Luxene has emerged from stealth, launching a novel approach to road safety by replacing passive reflective lines with actively illuminated guidance strips.

Future-fitting systems engineering skills across organizational boundaries

Vanderlande and TNO-ESI joined forces to map the skills architects and integration specialists need, to streamline the development of increasingly complex systems. The collaboration has yielded a tailored competency framework and a replicable methodology for other high-tech companies.

Rick Clemmer to guide Xiver

Former NXP CEO Rick Clemmer will join Xiver as chairman of its advisory board and as an investor.

Keiron raises €2.3M for accelerated rollout of solder paste printer

Eindhoven-based Keiron Printing Technologies has increased its seed capital by 2.3 million euros, bringing the total to 10 million euros.

Hybrid bonding heats up as Canon and LG take on established players

Canon and LG are entering the already crowded market for hybrid-bonding equipment. Canon is targeting a 2026 launch, while LG aims to be ready in 2028. Their moves put established players like Besi and ASMPT on alert.

China’s Prinano delivers first domestic nanoimprint litho tool

Chinese firm Prinano has announced the first delivery of a homegrown nanoimprint lithography machine.

XLight secures $40M to develop EUV light source

US startup XLight has raised 40 million dollars in Series B funding to support the development and prototyping of an EUV light source based on a free-electron laser (FEL).

In other news

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2Q25 foundry revenue surges to record high, TSMC’s market share hits 70 percent (Trendforce)

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Agentic AI will aid scientific discovery but needs humans in the loop (EE Times)

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The unlikely revival of nuclear batteries (IEEE Spectrum)

Elite academics don’t care about innovation

Turning research into real-world applications should be a core task for all academics, argues Martijn Heck.

Bits&Chips talks to Trumpf’s Jonathan Müller (part 2)

In a series of interviews, Bits&Chips delves into the collaboration between ASML and its German laser partner, Trumpf.

The AI-driven company: the R&D process

Jan Bosch identifies five stages that companies evolve through in their R&D: the AI assistant, the AI compensator, the AI supercharger, the AI system generator and the kaizen AI generator.

High Tech Campus welcomes Dai Nippon Printing

Dai Nippon Printing (DNP) will establish its first overseas research and development center in the Netherlands this September.

Competition in automotive chips is mounting

Even as the global automotive market grows at a modest ~2 percent CAGR between 2024 and 2030, automotive semiconductors are accelerating five times faster, according to Yole Group’s latest research.

Electronics market in a two-speed reality, warns Trendforce

Shipments of consumer electronics devices such as smartphones, notebooks, wearables, and TVs will be flat or shrinking, weighed down by high inflation, geopolitical uncertainty, and the absence of breakthrough features, according to market research by Trendforce.

Aircision eyes second-gen free-space optics powered by integrated photonics

As the Eindhoven-based startup Aircision is readying a first wave of ‘fiber optics through the air,’ it’s eyeing integrated photonics to power a next generation of products.