Fonontech lands €8.5M for chip packaging printing tech

Eindhoven-based Fonontech has secured an 8.5-million-euro seed investment. The Holst Centre spinoff focused on printing interconnects in semiconductor packaging will use the proceeds to finalize development of its first product and find traction with customers. To scale quickly with in-house production, the company expects to close a new round later this year.

Fotontech’s impulse printing technique transfers, like lithography, fine-grained patterns onto a substrate, but at a price tag and throughput more similar to conventional printing methods. Essentially, a paste (‘ink’) is shot onto a substrate, with the paste conforming to surface topology. It can even bridge gaps or wrap around corners.

“Fonontech is creating a new equipment category, not only in semiconductors but also in the display industry. With over 100 years of experience in the leadership team and sales potential of 1 billion euro within five years, we have exciting times ahead,” comments Sake Bosch, lead investor of this seed round. Innovation Industries, the Brabant Development Agency (BOM), TNO and Shift Invest also participated.