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Headlines
Background
Ligentec’s photonics ambitions grow beyond silicon nitride
Ligentec is moving beyond its roots in passive photonics. With new capabilities in modulators, detectors and lasers, the Swiss-French company is betting on heterogeneous integration to stay ahead in a fast-evolving market.
Opinion
We have a need for speed
Jan Bosch calls for a new culture among, especially young, people on our continent. One where risk-taking is encouraged and those who are successful are rewarded handsomely for the value they bring to Europe.
Editorial
Minister Karremans still lives in the pre-Trump era
Rules no longer matter. Only power does.
Interview
Cost pressure in 3D integration opens door for ASML’s precision play
ASML CEO Christophe Fouquet sees opportunities for his firm to enhance 3D integration tool maturity and throughput, applying the same principles that drove the success of EUV and metrology. Don’t expect the payoff to materialize quickly, though.
Background
When every photon counts: Microalign’s key-enabling tech for photonic quantum computing
The ultra-precisely aligned fiber arrays of Dutch startup Microalign address one of the biggest bottlenecks standing in the way of quantum computing at scale.
Editorial
Why abolishing cum laude for PhDs is painful but necessary
Editor Paul van Gerven believes in recognizing exceptional performance, but the cum laude distinction is too dependent on randomness and personal preferences.
Analysis
The semiconductor industry is showing restraint amid AI boom
Seasoned by previous boom-bust cycles, chipmakers are only modestly increasing capex.
Top job
Events
Courses
Interview
Building a Dutch-Korean precision bridge
Hak Kyung Sung and his Sobujang Forum, a group of several hundred Korean tech companies, is seeking close collaboration with Dutch partners. Bits&Chips sat down with “Dr. Sung” at last week’s Precision Fair to talk about the opportunities that are on the horizon when Dutch and Korean companies work together.
News
TNO brings CITC in-house to fast-track advanced packaging ambitions
In a move aimed at bolstering innovation in the semiconductor back-end, TNO is absorbing the Chip Integration Technology Center (CITC) into its High Tech Industry unit.
News
US startup launches quantum-MRI platform to visualize currents inside chips
Dutch capital is backing a US push into quantum-enhanced semiconductor metrology targeting 3D architectures.
Analysis
Integrated photonics gets its moment – now Europe must catch on
Integrated photonics is ripe for adoption by the semiconductor industry’s top players, thanks in no small part to AI’s insatiable appetite for bandwidth. But as industry leaders convene in Eindhoven, a question looms: Can the European ecosystem convert innovation into impact?
News
ChipNL CC kicks off with a design platform for chips
The EU Chips Design Platform aims to lower the threshold for IC designs, particularly for startups and academia. During the launch of ChipNL Competence Center at the Noviotech Campus in Nijmegen, coordinator Romano Hoofman laid down the broad outlines.
Background
“AI won’t replace designers – but it will change everything”
At the opening of the ChipNL Competence Center at the Noviotech Campus in Nijmegen, optimism and uncertainty collided. Behind the ceremonial tone, a deeper question emerged during a discussion session on the influence of artificial intelligence on chip design. How should Europe respond?
Analysis
Nanoimprint lithography won’t compete with EUV anytime soon
A new analysis refutes Canon’s claims that nanoimprint lithography can take on EUV.