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NXP picks up €1B loan from EIB
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TSMC plans record capex in 2025
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Metrology equipment to be added to Dutch export restriction list
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Sluggish semi recovery to continue in 2025, says Future Horizons
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Enocean takes Undagrid’s asset management to new heights
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Imec spinoff Vertical Compute tackles memory bottleneck
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Imec demonstrates wafer-scale GaAs lasers on silicon
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Photon IP bags €4.8M for III-V and silicon integration
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TNO leader hints at shedding activities
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Septentrio finds new owner in Sweden
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NXP absorbs Austrian SDV partner TTTech Auto
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Intel confirms H2 2025 mass production of 18A chip
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Imec real-world test confirms perovskite solar cell stability
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Swave Photonics secures €27M to power holographic displays
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US Commerce Secretary: “Trying to hold China back is a fool’s errand”
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EUV hits Japan as Rapidus installs first tool
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MIT spinoff CFS builds grid-scale fusion power plant
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John van Soerland to lead MEMS foundry Xiver
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NXP acquires US connectivity specialist Aviva Links
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NYT: US to launch probe into Chinese mature semiconductor sector
ASML’s road to 1000-watt EUV source power
EUV source technology is on the verge of a major overhaul. Power output is set to double this year to 600 watts, while the roadmap extends beyond 1,000 watts.
Europe plays its part in the ongoing AI revolution
It’s difficult to match the investment in artificial intelligence by the US tech giants, but Europe has strengths that it can play to successfully.
Organized chaos gets the job done
Dutch corporate tech culture can be a difficult hurdle for foreigners to overcome. That’s why software developer ICT Strypes asked High Tech Institute to host an in-company corporate culture course for their Portuguese engineers.
Taking stock at the start of tech year 2025
A review of key issues at hand as we enter the new year.
Shining brighter: a 10x source power efficiency boost for EUV lithography
Switching drive laser technology could improve EUV source power efficiency by a factor of ten. A project in the US will investigate.
ASML Investor Day takeaways: the future of EUV
From about 2030 onward, ASML will offer a single EUV platform that can be fitted with different sets of optics.
ASML Investor Day takeaways: a first step in the back-end
In 2025, ASML will introduce a wide-field i-line scanner, marking the firm’s first step in the back-end semiconductor market.
Four essential reads on Gelsinger’s exit
A mercy retirement, a grilling of Intel’s board, the shackles of the US Chips Act and saving Intel Foundry first and foremost – here are the best analyses the web has to offer about Intel’s future after Pat Gelsinger’s surprise resignation.
When the pressure mounts: Eindhoven’s Vitalwear takes on bed sores
The dreaded pressure ulcer may become a thing of the past thanks to a startup’s high-tech bed sheets that can detect the formation of the painful wounds.
Data dashboards – also for engineering
Combining dashboards for operators and engineers allows for even faster analysis of production line issues. For now, artificial intelligence won’t take their place, Angelo Hulshout believes.
ASML Investor Day takeaways: DRAM’s road ahead
For a product considered to be a commodity, DRAM has quite an exciting roadmap.
ASM, ASML and Nexperia not impacted by new US semicon export crackdown (for now)
ASM and ASML are exempt in a new round of US export curbs, although a national rule update could change that. Nexperia isn’t directly affected.
“Hybrid bonding is one of the most competitive semicon equipment markets”
Suss Microtec stepped into the hybrid-bonding market this year with a machine focused on R&D. At Semicon Europe, Bits&Chips sat down with Thomas Schmidt to talk about his company’s hybrid-bonding strategy.
ASML’s 2030 sales forecast is built on shaky foundations
AI-driven sales are a rather unreliable source of revenue for semiconductor equipment manufacturers in the medium term.