Headlines
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Cocotec and Sioux partner in reliable systems development
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Big Tech offers to bankroll SK Hynix chip expansion
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Frostbyte bags €1.3M for scalable quantum control chips
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Eyeo raises €40M to commercialize light-splitting image sensors
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Imec: High-NA EUV saves 3-4 masks at A14 and A10 node
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Global chip sales jump 25 percent in first quarter of 2026
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Quantum Machines acquires Delft spinoff QHarbor
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Quantware lands record €152M to scale quantum processor production
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Delft’s Vydar secures US funding for GPS-free drone navigation
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European tech bosses: EU in “crisis of our own making”
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Prodrive appoints new CEO after previous breakup
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Executive reshuffle at Axini
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Groove Quantum raises €16M, claims largest semiconductor spin-qubit processor
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EU reworks Chips Act to allow direct investment in fabs
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Delft startup Fiducial raises €2M for drone autonomy without GPS or radar
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NXP benefits from AI data center boom, too
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Quantum investor QDNL Participations rebrands after $88M fundraise
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UT and Harvard push on-chip UV light generation to milliwatt levels
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Martin van den Brink steps down from ASM supervisory board
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TSMC maps dual-track roadmap to 2029 with A12, A13 and N2U
News
Quantum computing inches toward real-world biology applications
Waiting for super-powerful quantum computers isn’t necessary: Hybrid quantum-classical systems can deliver practical scientific value.
Opinion
Where’s our Nvidia?
Why do the Low Lands produce world-class IC designers, but no world-class IC design companies, Bram Nauta wonders.
Analysis
The end of long copper: Silicon photonics marches toward the GPU
Nvidia is moving the electrical-to-optical boundary ever closer to the GPU as bandwidth demand continues to rise.
Background
“A requirement without constraints remains open to interpretation”
Unambiguous requirements are important for successful validation, but they’re difficult to establish in practice. By more clearly defining, structuring and tracing the development process of a system, many problems at a later stage can be prevented, TMC’s Bart van Liere learned at a training from High Tech Institute.
In memoriam
Richard Fierkens (1935-2026): a forgotten Dutch chip pioneer
From coat hangers to chip packaging: Richard Fierkens’ workshop in rural Herwen grew into a cornerstone of the Dutch semiconductor industry.
Video
Bits&Chips talks to Tracxon’s Ashok Sridhar
Tracxon wants nothing less than to reinvent how printed electronics and flexible circuit boards are manufactured – with a strong focus on sustainability and scalable production.
Analysis
Why is TSMC not in a rush to adopt high-NA EUV?
TSMC is holding off on high-NA EUV, even as Intel pushes ahead. The decision underscores a deeper divide in how the chipmakers weigh cost, complexity and risk at the leading edge.
Top job
Events
Courses
News
ASML determined not to be a bottleneck again in the chip upswing
ASML’s ability to expand capacity is being put to the test as the company vows to avoid constraining a semiconductor upcycle driven by AI demand.
News
Invisix steps out from under ASML’s wings with soft X-ray metrology bet
Dutch startup Invisix, spun out of ASML R&D, is betting that soft X-ray scatterometry can close a growing visibility gap in semiconductor manufacturing.
News
Hitachi plants Eindhoven flag to speed up metrology innovation
After more than a decade of collaboration with Dutch partners, Hitachi High-Tech has established a presence in Eindhoven. The move is aimed at enabling faster iteration cycles and tighter integration as semiconductor metrology grows more complex.
Editorial
A Dutch back-end fab would fit into a broader European picture
The business case for a back-end fab in the Netherlands is uncertain and the risks are real. Yet, initiatives with intrinsic potential to strengthen the vitality of Europe’s chip ecosystem shouldn’t be dismissed too easily.
Background
“A Dutch OSAT mustn’t depend on R&D subsidies”
Dutch back-end semiconductor experts are exploring the idea of establishing an independent assembly and test facility for panel-level packaging. The concept was recently presented at a meeting in Nieuwspoort in The Hague.
Video
Bits&Chips talks to Imec’s Eric Beyne
Eric Beyne is a senior fellow at Imec, where he’s responsible for 3D system integration. As an introduction to his keynote talk at the Benelux Heterogeneous Integration Conference, on 22 May in Veldhoven, Bits&Chips spoke with him about advanced packaging and current 3D trends in the semiconductor industry.
Editorial
ASML’s aura takes a hit
ASML could have used its considerable financial firepower to avoid the reputational damage of a mass layoff.















