Headlines
-
TUE researchers secure €950K for greener atomic layer etching
-
Imec spin-off Noak raises €5M to scale tandem solar technology
-
Nexperia sues Wingtech and founder Zhang for damages
-
ICT discontinues Improve
-
Marvell to acquire Lumentum in push for optical AI connectivity
-
Hardt Hyperloop secures funding for restart after bankruptcy
-
Imec partners with Belgian Defense for military technology development
-
Demcon targets photonics assembly bottleneck with laser-written connections
-
Sandgrain appoints Jan Jager as CEO
-
Olaf van der Sluis takes helm of TUE’s Casimir Institute
-
Samsung’s 2026 capex surges to $59B
-
NXP upbeat on software-defined vehicles outlook
-
ASM to meet 2030 revenue target three years early
-
Netherlands commits over €300M to boost medtech
-
Photonfirst and Naval Group to test fiber-optic sensors on naval vessels
-
Flemish millions for defense growth with space tech
-
Applied Materials to raise Besi stake to approximately 20 percent
-
Nexperia reports further growth as it expands production outside China
-
Summit in Delft addresses Europe’s shortage of systems thinkers
-
Micron rules out 4F² DRAM in favor of continued scaling and 3D transition
Opinie
Want more spin-offs? Let researchers reap the rewards
The more universities claim from the proceeds of an invention, the less researchers invent and the fewer businesses they start.
Opinion
Mission Impossible
Software has been eating the world and now AI is eating software. Rix Groenboom wonders how ICT education programs can still fulfill their role.
Background
Trumpf plasma generator business redirects to semiconductor production
Trumpf is betting on the growing demand for advanced plasma generators in semiconductor manufacturing. The German company is moving series production to Poland to cut costs, while concentrating R&D and new product development in Freiburg. Its EUV customer ASML will also benefit.
News
Musk reportedly open to TSMC running Terafab
With an “insanely fast” production schedule to meet, Musk is reportedly softening on who should be in charge.
Background
“Hybrid bonding requires more than a highly accurate machine”
Even silicon starts behaving like rubber on a microscopic level. As hybrid bonding moves toward pitches of 1 micrometer and below, tiny deformations become a major obstacle. Research by Besi and Imec shows why mastering the process is just as important as building a highly accurate bonding machine.
Analysis
The great DRAM divide: different paths to denser memory
The world’s leading DRAM manufacturers are taking different approaches to the next generation of memory technology.
Background
“The best solution is often found at the intersection of different disciplines”
In high-tech systems development, a decision made within one discipline can have consequences throughout the entire system. Electronics architect Newton Fonseca encounters this throughout his work at VDL ETG Technology & Development. He found the same system-level perspective running through three High Tech Institute courses, from broad mechatronic design to the more specialized field of actuation.
Top job
Events
Courses
Background
Reaching your audience’s head, heart and hands
Many people give presentations without knowing why. What do you want to achieve with your talk? When is your presentation a success?
Analysis
Intel’s quantum computing push builds on Delft research
Qutech played a key role in taking silicon spin-qubit technology from lab to fab.
Analysis
Bad news for Besi: ASML is getting into hybrid bonding
Semianalysis identifies ASML as the biggest threat to Besi’s largest growth market, hybrid bonding. Most strikingly, the Duiven-based company felt compelled to respond to the analysis with a statement about its alleged competitor.
Background
Beyond tin: Three challengers take aim at EUV’s light source
Three US companies are developing accelerator-based alternatives to the tin-plasma source at the heart of ASML’s EUV scanners. They promise more usable power, cleaner and more controllable light and ultimately the freedom to move beyond today’s 13.5-nanometer wavelength.
Background
45 years after the I²C patent: the story behind the two wires
On 22 October 1981, Philips filed a European patent application for a communication system between integrated circuits that would later become known worldwide as the I²C bus. Forty-five years later, the basic principle is still going strong.
News
Besi sees increasing momentum for hybrid bonding
CEO Richard Blickman seeks to allay fears of a slowdown in his firm’s primary growth market.
Background
Here’s why systems architects love product managers with no blah blah
What do you need a product manager for? Can’t AI do that? Xaviera Reynhout from Koers&Koffie tells you why at the Bits&Chips Event 2026.















