Headlines
News
ASMPT develops latest-generation hybrid bonder in Beuningen
ASMPT is developing its new generation of hybrid bonders in Beuningen as part of increased investment in advanced packaging in the Netherlands.
News
Imec pushes superconducting computing toward CMOS-scale integration
Imec has taken another step toward making superconducting processors manufacturable at semiconductor scale. The institute’s latest NbTiN process combines record integration density with ultrafine wiring, addressing one of the technology’s biggest barriers to adoption.
News
TSMC and ASML rally chip industry behind larger photomasks for high-NA EUV
TSMC and ASML are kicking off an industry-wide effort to double the size of high-NA EUV photomasks, a move expected to boost scanner productivity by around 40 percent.
News
TNO calls for a system-centric industrial policy
Industrial policy should mirror the AI-driven shift toward system-level architectures, TNO argues.
Interview
Marco Pieters starts engineering ASML’s next chapter
In office for almost a year, ASML CTO Marco Pieters speaks on his years in the trenches, the difficult reorganization he oversees and his company’s bet on 3D integration.
Background
Why are so many presentations so mind-numbingly boring?
Every talk should contain some content, but don’t waterboard your audience with information. It should also give them reasons to keep listening. And it should change them – what will they do after they leave?
Top job
Events
Courses
Background
Future-proof automation solutions for semiconductor manufacturing
Semiconductor manufacturing faces significant challenges – increasing precision requirements, higher speeds and growing demands for flexibility are shaping the future. Beckhoff showcases how automation is helping its customers meet these challenges.
Editorial
ASML shouldn’t overplay its hand with opportunistic price increases
By focusing on cost savings, improving the reliability and performance of its systems, it will automatically capture a larger share of the pie.
Background
Unstacking the future: navigating the 3D IC frontier
3D IC development introduces new system-level hurdles that demand innovative solutions that address exploration, design, analysis, reliability and test.
Editorial
Will the Match Act trigger another ‘Greenland moment’ for the EU?
The Netherlands and the EU will soon have to decide whether safeguarding technological sovereignty calls for the same resolve shown in defending Greenland’s territorial sovereignty.
News
Qubit on the move points the way to scalable silicon quantum chips
Instead of adding more wiring between qubits, Qutech researchers let one qubit do the travelling. The resulting architecture could simplify the design of future fault-tolerant quantum processors.
Analysis
Precision makes headlines, productivity wins markets
Five immersion scanners this year, twenty next year. Speculation about an imminent wave of Chinese lithography systems is causing turbulence in the stock market. In the industry itself, however, there’s little reason for alarm.
Analysis
Joining French OSAT initiative offers opportunities for Nexperia
Nexperia should become a shareholder in Tessalia. Investing in the French advanced packaging initiative would strengthen Europe’s semiconductor ecosystem while giving the planned Dutch panel-level OSAT a significant head start.