Headlines
News
TNO calls for a system-centric industrial policy
Industrial policy should mirror the AI-driven shift toward system-level architectures, TNO argues.
Opinion
Ask the headhunter
Recently, the department at a large chip company where I’ve worked for several years was closed, leaving me to look for another job.
Interview
Marco Pieters starts engineering ASML’s next chapter
In office for almost a year, ASML CTO Marco Pieters speaks on his years in the trenches, the difficult reorganization he oversees and his company’s bet on 3D integration.
Background
Why are so many presentations so mind-numbingly boring?
Every talk should contain some content, but don’t waterboard your audience with information. It should also give them reasons to keep listening. And it should change them – what will they do after they leave?
Editorial
ASML shouldn’t overplay its hand with opportunistic price increases
By focusing on cost savings, improving the reliability and performance of its systems, it will automatically capture a larger share of the pie.
Background
Unstacking the future: navigating the 3D IC frontier
3D IC development introduces new system-level hurdles that demand innovative solutions that address exploration, design, analysis, reliability and test.
Editorial
Will the Match Act trigger another ‘Greenland moment’ for the EU?
The Netherlands and the EU will soon have to decide whether safeguarding technological sovereignty calls for the same resolve shown in defending Greenland’s territorial sovereignty.
Top job
Events
Courses
News
Qubit on the move points the way to scalable silicon quantum chips
Instead of adding more wiring between qubits, Qutech researchers let one qubit do the travelling. The resulting architecture could simplify the design of future fault-tolerant quantum processors.
Analysis
Precision makes headlines, productivity wins markets
Five immersion scanners this year, twenty next year. Speculation about an imminent wave of Chinese lithography systems is causing turbulence in the stock market. In the industry itself, however, there’s little reason for alarm.
Analysis
Joining French OSAT initiative offers opportunities for Nexperia
Nexperia should become a shareholder in Tessalia. Investing in the French advanced packaging initiative would strengthen Europe’s semiconductor ecosystem while giving the planned Dutch panel-level OSAT a significant head start.
Editorial
TSMC waits, Intel pays for high-NA EUV
It’s only a matter of time before TSMC starts ordering high-NA tools, is ASML’s message. Once the technology reaches full maturity, high-NA will become more cost-effective than low-NA multiple patterning.
Editorial
You can’t address AI’s risks by banning ASML’s exports
Only international agreements can put meaningful guardrails on AI.
Editorial
Besi’s blue ocean is slowly turning redder
As hybrid bonding matures, a wave of consolidation is bound to follow, and Besi will eventually have to share the pie.
Background
Besi leads hybrid-bonding race, with twenty players chasing
Everyone is piling into hybrid bonding, the holy grail for stacking chips. Twenty platforms are now in development worldwide. Yet, Besi remains confident about its lead.