Headlines
In memoriam
Richard Fierkens (1935-2026): a forgotten Dutch chip pioneer
From coat hangers to chip packaging: Richard Fierkens’ workshop in rural Herwen grew into a cornerstone of the Dutch semiconductor industry.
Opinion
From building software to building learning systems
Organizations that take this transition seriously won’t simply have better features; they’ll have a compounding structural advantage that widens with every deployment cycle.
Video
Bits&Chips talks to Tracxon’s Ashok Sridhar
Tracxon wants nothing less than to reinvent how printed electronics and flexible circuit boards are manufactured – with a strong focus on sustainability and scalable production.
Analysis
Why is TSMC not in a rush to adopt high-NA EUV?
TSMC is holding off on high-NA EUV, even as Intel pushes ahead. The decision underscores a deeper divide in how the chipmakers weigh cost, complexity and risk at the leading edge.
News
ASML determined not to be a bottleneck again in the chip upswing
ASML’s ability to expand capacity is being put to the test as the company vows to avoid constraining a semiconductor upcycle driven by AI demand.
News
Invisix steps out from under ASML’s wings with soft X-ray metrology bet
Dutch startup Invisix, spun out of ASML R&D, is betting that soft X-ray scatterometry can close a growing visibility gap in semiconductor manufacturing.
News
Hitachi plants Eindhoven flag to speed up metrology innovation
After more than a decade of collaboration with Dutch partners, Hitachi High-Tech has established a presence in Eindhoven. The move is aimed at enabling faster iteration cycles and tighter integration as semiconductor metrology grows more complex.
Top job
Events
Courses
Editorial
A Dutch back-end fab would fit into a broader European picture
The business case for a back-end fab in the Netherlands is uncertain and the risks are real. Yet, initiatives with intrinsic potential to strengthen the vitality of Europe’s chip ecosystem shouldn’t be dismissed too easily.
Background
“A Dutch OSAT mustn’t depend on R&D subsidies”
Dutch back-end semiconductor experts are exploring the idea of establishing an independent assembly and test facility for panel-level packaging. The concept was recently presented at a meeting in Nieuwspoort in The Hague.
Video
Bits&Chips talks to Imec’s Eric Beyne
Eric Beyne is a senior fellow at Imec, where he’s responsible for 3D system integration. As an introduction to his keynote talk at the Benelux Heterogeneous Integration Conference, on 22 May in Veldhoven, Bits&Chips spoke with him about advanced packaging and current 3D trends in the semiconductor industry.
Editorial
ASML’s aura takes a hit
ASML could have used its considerable financial firepower to avoid the reputational damage of a mass layoff.
News
ASML lifts 2026 sales forecast as customers expand capacity
ASML now expects 2026 revenue between 36 billion and 40 billion euros, driven in part by higher-than-expected demand for immersion tools and continued EUV shipments.
Background
Taiwan’s ITRI looks to strengthen ties with Europe
Integrated photonics and edge applications are becoming a focal point for collaboration between the Netherlands and Taiwan. Backed by new funding and shared ambitions, both sides are exploring how European research strength and Taiwanese manufacturing power can reinforce each other.
Interview
Tusk IC bets on CMOS to power Europe’s satellite autonomy
Tusk IC is developing critical components for a new space economy: chips that enable the transmission and reception of millimeter-wave signals. The Antwerp-based startup is focused on CMOS, semiconductor technology that has all the benefits of scale and cost reduction.