Your cart is currently empty!
Headlines
News
SK Hynix to use Infinitesima’s AFM metrology in HBM production
The Korean chip manufacturer has ordered AFM metrology equipment from UK’s Infinitesima for the in-line inspection of high-bandwidth memory packaging, an essential part of AI systems.
Opinion
Drilling for boring
Could the toxic and dishonest rhetoric from the political arena penetrate the scientific community, Bram Nauta wonders?
Background
The poor man’s solution to leading-edge semiconductor manufacturing
Swedish startup Alixlabs is preparing for commercial deployment of a new semiconductor patterning technique that unlocks leading-edge semiconductor manufacturing without the need for EUV. Chip desert Europe should take advantage, says co-founder Jonas Sundqvist.
Background
A DAF engineer in Sunnyvale
From July to September 2024, DAF software engineer Marius Lepindea had the opportunity to work at the PACCAR Innovation Center in California.
Analysis
Besi’s balancing act to secure its leading position in hybrid bonding
Virtually all of TSMC’s major American customers are embracing hybrid bonding. This puts its main supplier Besi in a position that’s strong but not unassailable.
News
Dutch industry feels the pinch of China’s rare earth export controls
Crucial components that rely on the unique properties of rare earth metals are becoming increasingly difficult to source after the implementation of Chinese export controls.
Editorial
ASML’s maskless scanner is a matter of time
Will ASML take its maskless technology off the shelf and bring it to market in the coming years? René Raaijmakers thinks so, although that’s purely a gut feeling.
Top job
Events
Courses
News
Xenomatix makes lidar future-proof with solid-state Xavia
Leuven-based Xenomatix has optimized its lidar system to the point of mass production. Because the technology is solid-state, it’s more robust and easier to manufacture than other lidar systems, making advanced 3D sensing more scalable, affordable and future-proof.
News
Sydney scientists crack scalable CMOS quantum computing
Control electronics can be tightly packed with on-chip CMOS qubits without interfering with their operation, Australian research demonstrates.
Analysis
Analyst: the semiconductor landscape is being redrawn
The familiar semiconductor cycle is fragmenting into micro-cycles, leaving some market segments to fend for themselves, according to data analyst Claus Aasholm.
Background
Bright Photonics streamlines the integrated-photonics design journey
Thanks to 15 years of design flow development, Eindhoven-based design house Bright Photonics contractually guarantees its integrated-photonics designs are error-free.
News
Every photon counts: stacked perovskites outdo silicon image sensors
Swiss researchers have developed an image sensor using stacked perovskite layers, capturing full-color images with higher efficiency and accuracy and without the need for traditional color filters.
News
Kalpana brings “superspatial ALD” to the packaging industry
With “superspatial ALD” technology, Delft-based Kalpana Systems developed a compact roll-to-roll machine that deposits moisture- and oxygen-resistant barrier layers on flexible substrates. With this new form of ALD, the startup targets the markets of flexible OLED displays and solar cells and takes its first steps toward the packaging industry.
Video
Bits&Chips talks to Cees Links (part 1)
In a series of interviews with Bits&Chips (in Dutch), industry veteran Cees Links shares his views on the high tech. Part 1: Japan and Singapore.