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Headlines
Background
ASML’s road to 1000-watt EUV source power
EUV source technology is on the verge of a major overhaul. Power output is set to double this year to 600 watts, while the roadmap extends beyond 1,000 watts.
Opinion
Europe plays its part in the ongoing AI revolution
It’s difficult to match the investment in artificial intelligence by the US tech giants, but Europe has strengths that it can play to successfully.
Interview
Organized chaos gets the job done
Dutch corporate tech culture can be a difficult hurdle for foreigners to overcome. That’s why software developer ICT Strypes asked High Tech Institute to host an in-company corporate culture course for their Portuguese engineers.
Analysis
Taking stock at the start of tech year 2025
A review of key issues at hand as we enter the new year.
News
Shining brighter: a 10x source power efficiency boost for EUV lithography
Switching drive laser technology could improve EUV source power efficiency by a factor of ten. A project in the US will investigate.
Background
ASML Investor Day takeaways: the future of EUV
From about 2030 onward, ASML will offer a single EUV platform that can be fitted with different sets of optics.
Background
ASML Investor Day takeaways: a first step in the back-end
In 2025, ASML will introduce a wide-field i-line scanner, marking the firm’s first step in the back-end semiconductor market.
Top job
Events
Courses
Background
Four essential reads on Gelsinger’s exit
A mercy retirement, a grilling of Intel’s board, the shackles of the US Chips Act and saving Intel Foundry first and foremost – here are the best analyses the web has to offer about Intel’s future after Pat Gelsinger’s surprise resignation.
Background
When the pressure mounts: Eindhoven’s Vitalwear takes on bed sores
The dreaded pressure ulcer may become a thing of the past thanks to a startup’s high-tech bed sheets that can detect the formation of the painful wounds.
Background
Data dashboards – also for engineering
Combining dashboards for operators and engineers allows for even faster analysis of production line issues. For now, artificial intelligence won’t take their place, Angelo Hulshout believes.
Background
ASML Investor Day takeaways: DRAM’s road ahead
For a product considered to be a commodity, DRAM has quite an exciting roadmap.
News
ASM, ASML and Nexperia not impacted by new US semicon export crackdown (for now)
ASM and ASML are exempt in a new round of US export curbs, although a national rule update could change that. Nexperia isn’t directly affected.
Background
“Hybrid bonding is one of the most competitive semicon equipment markets”
Suss Microtec stepped into the hybrid-bonding market this year with a machine focused on R&D. At Semicon Europe, Bits&Chips sat down with Thomas Schmidt to talk about his company’s hybrid-bonding strategy.
Editorial
ASML’s 2030 sales forecast is built on shaky foundations
AI-driven sales are a rather unreliable source of revenue for semiconductor equipment manufacturers in the medium term.