Headlines
Analysis
TSMC’s capacity crunch leaves door ajar for Intel and Samsung
Accelerating AI demand that TSMC alone can’t satisfy offers a window of opportunity for Intel and Samsung to regain market share in the leading-edge semiconductor market.
Opinion
Ask the headhunter
As a physicist and entrepreneur, I’ve served as the founder and CEO of a semiconductor startup for the past four years.
News
Dutch court backs Sorama in dispute with Fluke
Court case reveals how a once-promising partnership between the Eindhoven University of Technology spinoff and the US equipment manufacturer turned sour.
News
Throwing AI caution to the wind, TSMC announces massive capex hike
TSMC is no longer playing it safe. Having grown confident that the AI boom is here to stay, the foundry giant is lifting capital spending to record levels.
Background
“MEMS-based miniaturization enables low-cost, distributed sensing at scale”
As devices become smaller, smarter and more complex, sensor technology increasingly determines system performance and reliability. MEMS play an important but often underestimated role in this shift. For engineers, a solid insight into MEMS is essential for the design, integration and adaptation of future systems.
Video
Bits&Chips talks to Frank Rood
In a series of interviews with Bits&Chips (in Dutch), Frank Rood shares his views on modular working in systems development.
Editorial
The courts won’t resolve the Nexperia conflict
When the Dutch Enterprise Chamber convened its first public hearing in the Nexperia case on Wednesday, it was asked to rule on governance. What it can’t rule on is time.
Top job
Events
Courses
News
KU Leuven team streamlines spine surgery with dual robots and ultrasound
Robotic spine surgery demands great accuracy, but current imaging methods fall short. A KU Leuven research team uses dual Kuka robots and real-time ultrasound to reduce that risk, aiming for safer, more accurate pedicle screw placement without relying on continuous CT imaging.
Editorial
Wennink’s problem analysis backfired
Peter Wennink sought to strengthen his case with a forcefully argued diagnosis of the problem. Unfortunately, it proved a distraction.
Background
Bosch’s approach to MEMS using multi-physics simulation
At a recent conference, Bosch was unusually open about how it designs MEMS sensors for large-scale production. Multi-physics simulation plays a central role in developing and industrializing wafer-scale MEMS sensors with high yield and predictable behavior.
Background
Learning actuation from expert engineers
When actuation became central in his Philips projects, Vinayak Kalas wanted more than old university notes. High Tech Institute’s “Actuation and power electronics” course, taught by engineers with real industry experience, offered exactly the practical, structured clarity he needed to apply the fundamentals the next day.
Editorial
China’s EUV “breakthrough”? Move along people, nothing to see here
China may have fired up a machine that emits EUV light, but that’s a far cry from producing chips.
Editorial
A fine report, Mr. Wennink. Now for the hard part: Does the Netherlands have the stomach for it?
After years of political drift, Peter Wennink’s call for an industrial revival sounds like music to high-tech ears. But how far can a growth strategy go when every necessary reform instantly runs aground in resistance, political theater and bureaucratic inertia?
Background
With Kinex, Applied and Besi provide a glimpse into their hybrid bonding technology
Applied Materials and Besi launched a fully integrated die-to-wafer hybrid bonding platform at Semicon West. Bits&Chips attended the press meeting about this system called Kinex during Semicon Europe in Munich.