TNO brings CITC in-house to fast-track advanced packaging ambitions

In a strategic move to reinforce the Netherlands’ position in semiconductor innovation, TNO has announced the integration of the Chip Integration Technology Center (CITC) into its High Tech Industry unit. The transition, effective 1 January 2026, underscores TNO’s sharpened focus on advanced packaging technologies and its ambition to scale both research and industrial relevance in the sector.

CITC was co-founded by TNO and Delft University of Technology, with the companies NXP, Nexperia and Ampleon participating from the outset. The institute’s activities will now be fully absorbed into TNO, reflecting an organizational realignment under TNO’s new strategic framework. “We’ve been doing a portfolio analysis across TNO,” says Arnaud de Jong, managing director of TNO’s High Tech Industry unit. “Some areas we’re scaling back. But advanced packaging is one of the technologies where we’re intensifying investment.”