Besi and ASMPT still far ahead in ever crowdier hybrid-bonding market

Regardless of all the big promises, the adoption of hybrid bonding is still limited. “Besi is the frontrunner in this segment,” observes Vishal Saroha, technology and market analyst for semiconductor equipment at Yole Group. “It’s an open secret.” Bits&Chips sat down with Saroha at Semi’s 3D & Systems summit to discuss current developments.

René Raaijmakers

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