Dutch back-end semiconductor experts are exploring the idea of establishing an independent assembly and test facility for panel-level packaging. The concept was recently presented at a meeting in Nieuwspoort in The Hague.
René Raaijmakers
This article is exclusively available to premium members of Bits&Chips. Already a premium member? Please log in. Not yet a premium member? Become one for just €20 for the first year and enjoy all the benefits.