CEO Richard Blickman seeks to allay fears of a slowdown in his firm’s primary growth market.
Besi’s hybrid-bonding orders in the first nine months of 2026 exceeded twice the total booked in all of 2025. The equipment maker now counts 23 hybrid-bonding customers, with cumulative demand exceeding 215 systems. The growth reflects more logic chiplet programs entering production. It’s also propped up by faster-than-expected expansion in co-packaged optics and the start of edge AI device production.
Hybrid bonding is currently primarily applied in logic manufacturing. Momentum for hybrid-bonding equipment got hit as memory makers pushed back the introduction of hybrid bonding in high-bandwidth memory (HBM). Nonetheless, interest from memory makers is increasing, says Besi CEO Richard Blickman in a press statement.
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