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Analysis

ASML comes technologically well-prepared to back-end market

18 June 2025
René Raaijmakers
Reading time: 8 minutes

This fall, ASML will launch a fast i-line machine for advanced packaging. It has another technological trump card up its sleeve for the back-end: maskless lithography. Second and final part of a brief overview: ASML’s system choices.

Will ASML dust off its maskless lithography technology in the coming years? This technology is perfect for back-end semiconductor applications, but it’s currently sitting in the proverbial freezer at TNO. Computer-controlled pattern writing that makes expensive masks redundant is interesting for applications where cost pressure plays a major role. It also comes in handy for small series or pilot production.

EV Group already supplies maskless lithography systems for back-end applications. The Austrian company plans to bring a faster version of its existing machine to market this fall. Nikon has announced that it will launch a maskless scanner for chip packaging in 2026.

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