ASML is exploring how to increase its production capacity from 2028 beyond previously announced plans. The planned expansion of 30 percent in 2027 and another 30 percent in 2028 for low-NA EUV and DUV immersion systems is proving insufficient to meet customer demand. The equipment maker hasn’t disclosed how much additional capacity is needed or feasible.
According to CEO Christophe Fouquet, customers expect their chip production capacity to fall short of demand until at least 2028. They’re therefore accelerating investment plans and announcing new fabs. ASML is already receiving substantial orders for 2028, while some customers are expressing interest in placing orders for 2029 and even 2030.
Alongside additional machines, upgrades and higher scanner productivity should help ease capacity shortages. The new NXE:3800F EUV scanner, which will be introduced in small quantities in 2027, increases throughput from 230 to 260 wafers per hour. New DUV immersion systems will reach 330 wafers per hour next year, according to CFO Roger Dassen.
ASML reported record third-quarter revenue of 11.7 billion euros and net income of 5 billion euros. Revenue from servicing and upgrades exceeded expectations at 3.3 billion euros, indicating that chipmakers are pursuing every opportunity to expand capacity quickly. For full-year 2026, ASML expects revenue of 44 billion to 45 billion euros, approximately 36 percent higher than last year.
