It’s time to throw the ballast overboard and set a clear course in the Netherlands.
It’s official: The Netherlands is the global center of gravity for hybrid bonding technology. The news that ASMPT has designated Beuningen in the Netherlands as a development location for advanced packaging R&D puts our country firmly on the map. Strikingly, the company is developing its new generation of hybrid bonders here rather than in Asia.
Advanced packaging and 3D technologies mark a new era in the chip industry, and our ecosystem is in an excellent starting position with players such as Besi, ASMPT, ASML, Nearfield Instruments and an extensive high-tech ecosystem. With this foundation, even entirely new business models become possible. Nearfield CEO Hamed Sadeghian presents an imaginative proposal. I won’t go into it further here; you can read more about it in this issue and on his company’s website.
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