Volume: 2026
Issue: 1
Date: 6 February 2026
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Volume: 2026
Issue: 1
Date: 6 February 2026
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Table of contents
AI boom finally reaches Veldhoven: ASML sees surge in demand
ASML cuts 1,700 leadership roles to declutter
Is 1,700 enough?
Europe’s sovereign AI future doesn’t need cutting-edge chip manufacturing
Intel quietly closes shop on High Tech Campus
Dutch court backs Sorama in dispute with Fluke
The courts won’t resolve the Nexperia conflict
Ask the headhunter
A fine report, Mr. Wennink. Now for the hard part: Does the Netherlands have the stomach for it?
Wennink’s problem analysis backfired
Europe’s photonics industry to EU: Don’t forget about us in next Chips Act
Today’s AI business models are so 19th century
China’s EUV “breakthrough”? Move along people, nothing to see here
Throwing AI caution to the wind, TSMC announces massive capex hike
TSMC’s capacity crunch leaves door ajar for Intel and Samsung
Rethinking the chip market pushes 2030 estimate to $1.6T
AI the super-flattener
KU Leuven team streamlines spine surgery with dual robots and ultrasound
Bosch’s approach to MEMS using multi-physics simulation
“MEMS-based miniaturization enables low-cost, distributed sensing at scale”
Learning actuation from expert engineers
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