Photon IP bags €4.8M for III-V and silicon integration

Eindhoven-based integrated-photonics startup Photon IP has raised 4.75 million euros in seed capital. The firm founded in 2020 will use the proceeds to accelerate the industrialization and commercialization of its technology that enables efficient integration of silicon photonics with III-V materials. “With our advanced optical engines, we’re setting a new performance benchmark and eliminating the barriers to efficiently combining III-V materials with silicon. This funding expands our ability to grow our team and bring our first products to market,” says Photon IP CEO Rui Santos.

With decades of manufacturing experience, silicon is an excellent substrate for integrated photonics. But without a direct gap, the material will never be able to generate light efficiently. Active components, such as light sources and amplifiers, therefore, require the use of direct-bandgap III-V materials. Both materials are typically processed separately before being combined. Photon IP has come up with a way to integrate them onto a single chip, simplifying the manufacturing process.

Photon IP’s latest fundraising round was led by Innovation Industries and participated in by Faber and the Brabantse Development Agency (BOM), with funding support from Photondelta. It follows the initial investment by Vigo Ventures in 2021 and a 2-million-euro grant from the European Innovation Council. Photon IP has already won several contracts from pioneering customers.