Besi and ASMPT still far ahead in ever crowdier hybrid-bonding market

Hybrid bonding (HB) is widely recognized as the most advanced path to achieving extremely fine-pitch interconnects in three-dimensional integration. Fusing chips or wafers at the dielectric and copper level creates monolithic assemblies with unparalleled bandwidth and energy efficiency.

Besi has taken a visible lead in die-to-wafer HB, working closely with Intel and TSMC. Yet, Vishal Saroha, technology and market analyst for semiconductor equipment at Yole Group, notes that the technology is still at the beginning of its commercial journey. So far, only a handful of high-end devices, such as AMD’s MI300 accelerator, have used HB in production. “Where we really see hybrid bonding coming into real force would be through high-bandwidth memory,” he says, “because that’s where you need more stacks and a better thermal capability, which hybrid bonding can provide.”