SK Hynix plans to acquire approximately twenty additional EUV lithography machines by 2027, according to Korean tech site ET News. The move effectively doubles the memory maker’s current fleet (including R&D units). These additions will be deployed across its Cheongju M15X and Icheon M16 fabs, supporting its push into next‑generation DRAM and high-bandwidth memory (HBM) production.
At last year’s Investor Day, ASML projected a 15-25 percent CAGR spending increase on EUV tools for DRAM manufacturing, driven by an accelerating 22 percent CAGR bit growth (up from 18 percent in 2015-2023) and by an increasing number of EUV exposures per die (from 5 in 2025 to 7-10 in 2030, less if high-NA is deployed). SK Hynix figured prominently at the event, with CTO Kwak Noh-Jung testifying in a video message that EUV plays an important part in the firm’s roadmap.
Earlier in September, SK Hynix announced the installation of the world’s first high-NA EUV scanner intended for high-volume production, the Twinscan EXE:5200B.
