High-NA tee-off has been set: 2026

Intel will deploy ASML’s high-NA EUV tools before 2027, the chip company unveiled. Speaking at the firm’s IFS Direct Connect event, CEO Pat Gelsinger confirmed that the upcoming 14A node will make use of high-NA. Although no explicit timing was announced, it’s safe to assume that 14A is scheduled for 2026, given the company’s recent cadence of at least one node per year. Intel said that the preceding 18A node is on track to start high-volume manufacturing in the second half of this year.

The timing matches the prediction of ASML, which said that the industry would see large-scale adoption of high-NA in the 2026/2027 time frame. TSMC and Samsung haven’t announced their plans for the next-generation EUV tool, however. There have been reports that the introduction has been delayed due to cost concerns. ASML has fired back at these allegations, and Intel told Tom’s Hardware that high-NA is cost-effective for the company’s purposes.