Volume: 2025
Issue: 8
Date: 12 December 2025
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Volume: 2025
Issue: 8
Date: 12 December 2025
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Table of contents
ASML CEO Fouquet: “The faster you grow, the less efficient you get”
Cost pressure in 3D integration opens door for ASML’s precision play
High-tech megaclusters
With Kinex, Applied and Besi provide a glimpse into their hybrid bonding technology
Building a Dutch-Korean precision bridge
Aalberts positions itself for semiconductor rebound with Asian acquisition
Minister Karremans still lives in the pre-Trump era
Embrace the Chinese
ChipNL CC kicks off with a design platform for chips
“AI won’t replace designers – but it will change everything”
Ask the headhunter
“The value isn’t in cutting costs, but in system integration”
5 billion for chips in the Netherlands
TNO brings CITC in-house to fast-track advanced packaging ambitions
Delft-based Quantware steps up quantum scaling with 10K-qubit QPU
We need to innovate the innovation ecosystem
Integrated photonics gets its moment – now Europe must catch on
When every photon counts: Microalign’s key-enabling tech for photonic quantum computing
Ligentec’s photonics ambitions grow beyond silicon nitride
Scaling the next barrier in molecular imaging for oncology needs updated trust mechanism
Nanoimprint lithography won’t compete with EUV anytime soon
The semiconductor industry is showing restraint amid AI boom
Ask the headhunter
US startup launches quantum-MRI platform to visualize currents inside chips
How Demcon deflates the space junk problem
Modular and future-proof – the machine building industry on the road to the digital future
Dear AI,
Why abolishing cum laude for PhDs is painful but necessary
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