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Headlines
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Annual 300 mm fab equipment spend to hit $138B by 2028
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New ASML CTO Marco Pieters steps into Brink’s big shoes
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Applied and Besi unveil integrated die-to-wafer hybrid bonder
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Photon Bridge finds launching customer for compact tunable laser PIC
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Leydenjar partners with Chinese firm to scale silicon-anode batteries
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Nexperia hit by expanded US restrictions
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Dutch epilepsy armband in Swedish hands
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TU Eindhoven launches Casimir Institute
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Founders commit to continuation of JADS
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Prodrive CEO steps down due to “differences in vision”
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Patrick Vandenameele to succeed Luc Van den hove as Imec CEO
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Photon Bridge rebrands and taps new CEO
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Imec and Diraq hit industrial-scale milestone for silicon quantum chips
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ASM projects doubling revenues by 2030
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Report: SK Hynix to double EUV capacity with 20 new units in two years
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Dutch laser chip finds ways to Austrian AR light engine
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Imec advances single-patterning capabilities of high-NA litho
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EU centralizes export controls, easing pressure on Dutch tech firms
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Intel and Nvidia announce $5B collaboration
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NMI obtains German testing grounds
News
Dutch government seizes control over Nexperia amid national security concerns
The Dutch government has taken the extraordinary step of sidelining the Chinese-controlled leadership of chipmaker Nexperia, citing threats to national security and fears of technology leakage to China.
Opinion
The AI-driven company: the AI-enabled product
On the AI maturity ladder for products, Jan Bosch identifies five steps that companies move through: static ML, dynamic ML, multiple ML, continuous ML and AI-first.
Editorial
Our education system both under- and overdelivers
The Netherlands squanders opportunities in primary and secondary education, but is too generous with them in higher education.
News
US turns up the heat on ASML’s China sales
ASML once again finds itself in Washington’s crosshairs as a congressional inquiry calls for a blanket ban on DUV immersion exports to China.
Video
Bits&Chips talks to Trumpf’s Matthias Wissert
In a series of interviews, Bits&Chips delves into the collaboration between ASML and its German laser partner, Trumpf.
Interview
Hybrid bonding crucial to integrate optical signaling in high-end compute
Bits&Chips sat down with Philippe Muller of Suss Microtec at Semi’s 3D & Systems Summit in Dresden to discuss co-packaged optics and the role of hybrid bonding technology in it.
Interview
Besi and ASMPT still far ahead in ever crowdier hybrid-bonding market
Regardless of all the big promises, the adoption of hybrid bonding is still limited. “Besi is the frontrunner in this segment,” observes Vishal Saroha, technology and market analyst for semiconductor equipment at Yole Group. “It’s an open secret.” Bits&Chips sat down with Saroha at Semi’s 3D & Systems summit to discuss current developments.
Top job
Events
Courses
Interview
“To solve complicated problems, we need everybody’s mind on it”
This fall, Jessica Korzeniowska will be teaching her award-winning fantasy-themed training course in basic systems engineering at High Tech Institute. Bits&Chips sat down with her to talk about her background, her experiences as a systems engineer, her teaching method and the importance of reaching out to students, especially girls.
News
Silicon Hive veterans launch ultra-efficient AI infrastructure
Emerging from stealth, Eindhoven-based Euclyd is reimagining inference from the ground up, with custom processors, custom memory and advanced 2.5D/3D packaging. The startup’s leadership brings together many of the brains from the illustrious Silicon Hive team.
In memoriam
Kees Beenakker (1948-2025): straight-talking innovator in microelectronics
With the passing of Kees Beenakker, the Netherlands has lost a figure as distinctive as he was influential in the world of microelectronics.
Video
Bits&Chips talks to ASML’s Ale Sytsma
Ale Sytsma installed the first Philips waferstepper at IBM in the United States.
Editorial
The Mistral deal: ASML says business, the world hears sovereignty
By tying up with Mistral AI, ASML insists it’s just doing business. But in an age when tech is power, the line between corporate pragmatism and geopolitics all but disappears.
News
Tracxon powers up for entry in PCB manufacturing equipment market
TNO spinoff Tracxon has raised 4.75 million euros to develop production equipment for multilayer printed circuit boards. The Eindhoven-based company is creating environmentally friendly alternatives to today’s highly polluting PCB industry and aims to sell machines for that purpose.
Background
Choosing the right connector for the job
RF connectors are crucial components in a variety of electronic devices and communication systems. They’re designed to transmit high-frequency signals with minimal signal loss and high reliability. But which electrical performance parameters are crucial for selecting the right connector?