Swedish equipment developer AlixLabs has begun a six-month evaluation of its atomic-layer etch pitch-splitting process in the NanoIC pilot line coordinated by Imec. The process divides a pre-patterned feature into two lines, potentially doubling pattern density with fewer steps than conventional multiple patterning. The project will test whether it can meet the dimensional and defect requirements of advanced chipmaking.
Imec will prepare fine line-and-space patterns and measure them before Alixlabs develops the process on small-wafer samples. Selected conditions will then be transferred to full wafers, which Imec will examine for uniformity, line roughness, pitch errors and defects. The partners haven’t reported performance results yet.
Alixlabs says potential customers requested validation at Imec as they assess the technology for advanced manufacturing. The company plans to use the results to guide further process integration and equipment qualification.
