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ASML takes a first step in back-end semicon
Reading time: 7 minutes
For the first time, ASML is introducing a system that’s also aimed at the back-end semiconductor market. Head of product management i-line, Martin Wassink, talks to Bits&Chips about the new XT260 wafer scanner.
During ASML’s Investor Day last November, Herman Boom already hinted at the XT260 i-line scanner his company expects to ship later this year. It reduces the pattern on the mask not fourfold but twofold. This allows it to scan a field twice as large as is possible with other ASML scanners (26 mm by 33 mm). To achieve its sustainability goals, the litho giant is currently testing whether it can transport some of its machines by boat. The XT260 is a typical system that qualifies for this type of journey.
Boom also touched on the business opportunities in November. The XT260 is mainly aimed at exposing interposers – advanced printed circuit boards. If these are made of silicon – they also come in ceramic and glass flavors –integrated circuits can be incorporated as well. This is usually done to speed up communication between chips and optimize energy consumption.
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