Imec’s (P)IC design and manufacturing service, IC-Link, has expanded its collaboration with TSMC to give chip developers easier access to advanced-node design infrastructure. By joining the foundry’s Open Innovation Platform Cloud Alliance, the Leuven-based ASIC and silicon photonics service provider will become the alliance’s first managed-cloud service supporting mixed-partner EDA flows. The offering combines access to TSMC process design kits with scalable computing infrastructure and IC-Link’s design support.
Customers can use their preferred EDA tool chains and licenses while IC-Link handles secure hosting, infrastructure management and access to the required design resources. The partners say this should reduce the burden of building and maintaining advanced chip design environments and shorten development cycles for applications including AI, communications, automotive and industrial systems.
