The global wafer fab equipment market is entering a new expansion phase that will lift annual sales at a 9-percent CAGR from 129 billion dollars in 2025 to almost 220 billion dollars by 2031, according to a new report from market research firm Yole Group. The patterning segment dominated by ASML will grow even faster at a 10.9-percent CAGR to 65 billion dollars.
The growth is primarily driven by increasing process complexity rather than broad-based demand for semiconductors. Advanced logic, high-bandwidth memory, NAND and advanced packaging are raising the amount and sophistication of manufacturing equipment required as chipmakers adopt gate-all-around transistors, high-NA EUV lithography, hybrid bonding and 3D integration.
