Besi’s balancing act to secure its leading position in hybrid bonding

A month before Besi provided an extensive business update to investors, it sent out a brief press release. The Duiven-based back-end equipment builder had received a follow-up order for five thermal compression bonders worth 20 million dollars. The company is expected to deliver the TCB Next systems in the fall.

Peter Wiedner, responsible for precision placement machines at Besi, said in the press release that he was pleased with the further market acceptance of his company’s most advanced TCB platform. “This important follow-up order confirms our position as a leading player in this rapidly evolving market.” Wiedner pointed to the two-track approach of many chip manufacturers. They deploy both advanced TCB and hybrid bonding machines for ‘wafer-level assembly,’ meaning: to stack chips on bare wafers full of ICs at the end of front-end chip production.