Armed with wafer-scale 2D semiconductor materials, US startup CDimension is looking to challenge silicon’s reign in leading-edge CMOS.
MIT spinoff CDimension has begun offering its 2D semiconductor materials for commercial sampling. The startup, which emerged from stealth in July, believes that its proprietary low-temperature deposition method for wafer-scale growth of transition metal dichalcogenides (TMDs) could accelerate the retirement of silicon as the world’s most pre-eminent semiconductor.
2D materials have long held promise for more powerful and energy-efficient chips. Imec has proposed a stepwise introduction, starting with mature-node peripheral devices at the A7 node and more widespread adoption by the A3 node, which is scheduled to enter commercial production in 2035. In a recent article, the Leuven-based research institute highlighted key challenges that need to be solved for that to happen, including wafer-scale deposition of high-quality material, gate stack integration and manufacturing low-resistance source/drain contacts and doping of 2D materials.


