Besi received the first orders for its hybrid bonders last quarter from memory maker Micron and back-end subcontractors Amkor and ASE. The chip recession is hitting harder than expected, though.
Last week’s Q&A during Besi’s quarterly results ended in an embarrassing moment for CEO Richard Blickman. One of the participating analysts sighed that he was a bit lost. “It’s very difficult to understand the nuances and all the things you’ve said and written in press releases. How many units for hybrid bonding do you think you’ll have shipped by the end of this year? Is this still the sort of high 20s you were talking about? Just to help us understand a little bit because you’re giving us too many hints and it’s just difficult for me at least, a simple analyst, to understand all these things.”
With that, Blickman received a firm slap on the wrist, as this was a seasoned analyst. During question-and-answer sessions following the presentation of company results, CEOs and CTOs are usually treated with complete respect. Participating analysts and investors always behave humbly, always thanking for the opportunity to ask questions.
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