Imec has demonstrated significant logic and SRAM cell area reduction when adopting a CFET-based standard cell architecture containing two rows of CFETs with a shared signal routing wall in between. The results of the design-technology co-optimization (DTCO) study were published at the 2024 IEEE International Electron Devices Meeting, this week in San Francisco.
Stacking nFET and pFET pairs on top of each other, the complementary FET of CFET promises benefits in power, performance and area (PPA) when combined with backside technologies for power delivery and signal routing. Imec expects the CFET to be introduced in manufacturing at the A7 node, succeeding the gate-all-around (GAA).
At the circuit level, however, several options are still open for integrating CFETs into a standard cell to sustain or enhance the expected PPA benefits. Imec believes it’s come up with an architecture that offers the most optimal trade-off between manufacturability and area efficiency for A7 logic nodes.


