As previously announced, Intel will use high-NA EUV lithography to manufacture 14A chips. However, deploying the second-generation EUV scanners is not without risk, and customers will be offered the option of using low-NA EUV patterning without changing their designs. Risk production of 14A is scheduled to start in 2027, with high-volume production to follow in 2028, Intel said at its Direct Connect event.
TSMC has yet to reveal its plans for high-NA insertion. It has confirmed that it won’t happen at the A14 node, which is roughly equivalent to Intel’s 14A and also expected to hit high-volume production in 2028.
Intel confirmed that 14A’s full-node predecessor, 18A, is now in risk production. This node is considered key in the firm’s struggle to stay relevant in leading-edge production. If it can pull off a high-yielding, competitive process, big fabless companies may start to divert some of their TSMC business. Intel CEO Lip-Bu Tan said that he’s committed to making the foundry operations successful, putting to rest (for now) rumors of a divestment or a collaboration with TSMC.
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