Eindhoven-based Keiron Printing Technologies has increased its seed capital by 2.3 million euros, bringing the total to 10 million euros. The company, a spinoff from TNO Holst Centre, will use the funds to accelerate the installation of its first solder paste deposition system. Keiron also plans to ramp up R&D activities and strengthen its operational base.
With Keiron’s laser-induced forward transfer (Lift) technology, the solder paste printing process can be controlled with nanoliter precision, offering more accuracy than traditional stencil printing techniques. This is crucial, since both too little and too much paste can lead to errors in electronics assembly, especially as technologies continue to shrink.
According to Keiron, Lift isn’t only highly precise and controllable but also scalable. The more accurate printing technique can help ensure that ever-smaller electronic components are placed more reliably onto circuit boards. This is particularly relevant for the manufacturing of complex electronics in applications where small errors can have major consequences, such as aerospace, defense and medical technology.
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