Eindhoven-based Keiron Printing Technologies has raised 20.7 million euros in a Series A funding round. The spinoff from TNO Holst Centre is developing a digital, contactless technology that uses lasers to apply solder paste to printed circuit boards. The funds will be used to scale up production, commercial activities, technical support and further development across Europe, North America, and Asia-Pacific. The recent round was led by Invest-NL, DeeptechXL and Waves Capital, with participation from Ramphastos Investments, ATUM Ventures, Cottonwood Technology Fund and TNO Ventures.
According to Keiron, solder paste printing is the step in the assembly process most prone to errors. It affects the speed, reliability and yield for electronics manufacturers around the world. With its laser-induced forward transfer technology (Lift), the Eindhoven company aims to offer an alternative to this step by applying solder paste to printed circuit boards with a laser instead of using stencil technology. This should make the production process faster and more reliable.
