Defense players Thales and Radiall are joining forces with Foxconn to build a fully automated OSAT facility that aims to give Europe a stronger foothold in advanced electronics manufacturing.
Thales is setting up an outsourced semiconductor assembly and test (OSAT) facility in Le Barp, a village of five thousand inhabitants southwest of Bordeaux. The primary goal is to secure access to production technology for heterogeneous integration and advanced chip packaging for aerospace and defense applications.
Bits&Chips reported earlier on the initiative, but the parties involved have since disclosed further details. “We’ll consume only 2 percent of the components ourselves,” said Didier Floriot, strategy director for technology, devices and materials at Thales Land and Air Systems, speaking at Semi’s 3D & Systems Summit in Dresden. He estimates that this will account for 4 percent of the OSAT facility’s total revenue. “The majority of revenue and volumes will go to automotive, telecom and other industrial sectors.”
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