Applied and Besi unveil integrated die-to-wafer hybrid bonder

Applied Materials and Besi have introduced Kinex, the industry’s first integrated die-to-wafer hybrid bonding system, designed to enable higher performance and lower power consumption for advanced logic and memory chips. The system combines all hybrid bonding steps – surface preparation, bonding and metrology – in one tool, promising tighter interconnect pitches, consistent bonding quality and improved cycle times.

The new system brings together Applied’s front-end processing expertise and Besi’s experience in bonding equipment. The collaboration builds on the companies’ earlier joint development efforts. In April 2025, Applied acquired a 9-percent stake in Besi to deepen their strategic alignment in hybrid bonding.

The new system is already being used by multiple leading logic, memory and OSAT customers.