ASMPT is developing its new generation of hybrid bonders in Beuningen as part of increased investment in advanced packaging in the Netherlands.
Advanced Laser Separation International (ALSI), a Philips Semiconductors spinoff, was on the verge of collapse after the 2009 financial crisis, but its acquisition by ASMPT breathed new life into the company. “We gained access to a global sales and service network and to capital to hire people and develop products,” said Kees-Jan Leliveld, the current managing director of ASMPT ALSI, during the celebration of the company’s 25th anniversary earlier this month.
ALSI, which makes machines for separating chips from wafers, had already gained a foothold at Osram. The Germans bought the first machines for their Regensburg facility to separate high-brightness LEDs. A second major market consisted of independent gallium arsenide foundries producing RF IC components for smartphones.
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