Eric Beyne is a senior fellow at Imec, where he’s responsible for 3D system integration. As an introduction to his keynote talk at the Benelux Heterogeneous Integration Conference, on 22 May in Veldhoven, Bits&Chips spoke with him about advanced packaging and current 3D trends in the semiconductor industry.
Now that two-dimensional scaling on chips is reaching its limits, the semiconductor industry is investing heavily in the third dimension. The entire industry is currently looking at hybrid bonding as the ultimate way to build 3D semiconductor systems. Whether this can be done cost-effectively and with high yields, however, remains a matter of debate.
Imec senior fellow Eric Beyne, for his part, is convinced that progress in chips is far from over. He also takes a pragmatic view of the current challenges surrounding hybrid bonding. He compares it to the early days of through-silicon via (TSV) packaging technology, which some believed would never succeed. “Whereas today, it has become completely standard,” says Beyne in an in-depth talk (in Dutch) with Bits&Chips.
This interview can be watched on Youtube and listened to on Apple Podcasts and Spotify.
