According to an analysis by Yole Group, the advanced-packaging market grew to 46 billion dollars last year. This is a rise of 19 percent YOY compared to 2023. Yole projects the market to exceed 79 billion dollars by 2030.
With a 70 percent share, mobile and consumer was the largest advanced-packaging market in 2024. The fastest growth is found in the telecom and infrastructure segment, where an unprecedented 14.9 percent CAGR is expected between 2024 and 2030. This is largely due to developments in AI, which require high-performance chips.
Integrated device manufacturers (IDMs) such as Intel, Sony and Samsung lead the top ten, together with outsourced semiconductor assembly and test companies (OSATs) like Amkor and ASE and foundries such as TSMC. According to Yole, a wave of unprecedented investments is reshaping the landscape.
