Bits&Chips sat down with Philippe Muller of Suss Microtec at Semi’s 3D & Systems Summit in Dresden to discuss co-packaged optics and the role of hybrid bonding technology in it.
The notion that hybrid bonding (HB) will penetrate all segments of chip manufacturing is widely adopted in the semicon industry. The technology is the ultimate way to combine single ICs or chiplets. HB seamlessly fuses these single pieces into a monolithic system with circuits on multiple levels. The first in line to adopt hybrid bonding are manufacturers of AI and high-end compute systems. With this technology, they merge high-bandwidth memory (HBM), silicon interposers, ASICs, graphics processors and microprocessors.
Suss Microtec is one of roughly fifteen players now developing equipment for this purpose. At the German company, Philippe Muller is working as a technology scout. “At Suss, we look at all market segments that are going to apply hybrid bonding and therefore also at co-packaged optics,” says Muller, who is always a striking presence at conferences with his colorful hats and matching suits.
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