Samsung Electronics is committing more than 110 trillion won, roughly 73 billion dollars, to expand chip capacity and accelerate research in 2026, marking its largest annual semiconductor investment to date. The spending represents a 22 percent increase year-over-year.
The investment push is primarily targeted at next-generation AI chips, including high-bandwidth memory, where SK Hynix has taken the lead. Samsung is attempting to close that gap by scaling production and leveraging its early commercial rollout of HBM4, alongside continued development of enhanced variants such as HBM4E. Partnerships are also deepening, with Nvidia endorsing Samsung’s 4nm process for upcoming processors and new supply agreements emerging with other AI players.
TSMC similarly announced a capex hike of about 32 percent recently.
