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Analysis

Joining French OSAT initiative offers opportunities for Nexperia

27 July 2026
René Raaijmakers
Founder of Bits&Chips and High Tech Institute | Tech writer
Reading time: 3 minutes

Nexperia should become a shareholder in Tessalia. Investing in the French advanced packaging initiative would strengthen Europe’s semiconductor ecosystem while giving the planned Dutch panel-level OSAT a significant head start.

There is no longer any need to debate whether Europe needs a strong advanced packaging industry. It does. The real question is how we can join forces in such a way that the entire EU semiconductor industry benefits as much as possible.

In the Netherlands, Nexperia subsidiary Itec, TNO and several backend companies are working on plans for an automated panel-level OSAT (outsourced semiconductor assembly and test). The idea is attractive because it could give Europe a technological edge. It could help the industry, from startups to giants, improve time to market. Whether we can also succeed in reducing costs remains to be seen, but in theory, it’s possible.

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