A group of Dutch semiconductor players is exploring the construction of an advanced back-end facility in the Netherlands. The move could reduce Europe’s dependence on Asia while accelerating innovation by shortening development cycles. The early-stage initiative was presented on Wednesday to industry leaders and policymakers at a Semiconpoort gathering in The Hague.
According to those involved, a ‘back-end 2.0’ approach could enable the return of chip assembly to Europe. By deploying highly automated production on large panels, costs could drop by 30-40 percent, said co-initiator Joep Stokkermans, R&D director at back-end equipment maker Itec. In addition, panel-based assembly is said to deliver improved electronic performance while reducing material waste, boosting overall sustainability.
Stakeholders are now assessing if European chipmakers are willing to back the initiative and under what conditions. If sufficient demand emerges to support the required scale, attention will shift to manufacturing technologies and financing. The preliminary goal is to have production up and running by around 2030.
