Semianalysis identifies ASML as the biggest threat to Besi’s largest growth market, hybrid bonding. Most strikingly, the Duiven-based company felt compelled to respond to the analysis with a statement about its alleged competitor.
Bad news for Besi. That’s the conclusion Semianalysis reached after examining ASML’s activities in hybrid bonding. The market research firm reviewed patent filings, the lithography giant’s technology roadmap and public statements, concluding that the Veldhoven-based company is pulling the rug out from under Besi’s hybrid-bonding ambitions.
It’s no secret that ASML is developing hybrid bonding technology. This first became abundantly clear during its 2024 Investor Day. At the time, however, the company referred to the technology in very general terms as “wafer bonding,” without going into specifics. It made no distinction between placing individual dies on wafers (die-to-wafer, D2W) and bonding entire wafers together (wafer-to-wafer, W2W).
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