ASML’s high-NA EUV scanners are nearing readiness for volume-production tests. Imaging performance, throughput and availability are all approaching target specifications, a spokesperson confirmed following reporting by Reuters. It will still take another two to three years for chipmakers to move the next-gen lithography tool into high-volume production, however.
The news marks a step forward from Intel’s completion of customer acceptance testing of an EXE:5200B last December. After customer acceptance, the tool may still be down for relatively long periods for adjustments or repairs. This precludes testing for production. With an 80 percent uptime and plans to achieve 90 percent by the end of the year, that situation has now changed.
ASML previously laid out a three-phase insertion schedule for high-NA. In phase 1, customers perform R&D in Veldhoven or on their own R&D tool, the EXE:5000. Throughput and availability aren’t critical in this phase. Next, ASML’s customers will start running 1-2 layers to test its readiness for volume manufacturing. Finally, they design in high-NA on their most critical layers and run volume manufacturing. We’re now in phase 2.
