ASML has begun “designing the overall architecture of a hybrid bonding tool,” Korean media outlet The Elec reports, citing people familiar with the matter. The Veldhoven-based equipment manufacturer is said to have engaged with external partners, including Prodrive Technologies and VDL ETG. Both are suppliers of key technologies for the maglev wafer stages that would also be essential for increasing precision and speed in hybrid bonding. ASML declined to comment on the report.
ASML CEO Christophe Fouquet previously told Bits&Chips that his firm has started exploring potential opportunities in the 3D integration arena, including hybrid bonding. In November last year, however, these efforts were still in the R&D stages, with significant impact on revenue expected “well beyond 2030.”
