Details and products are still under wraps, but ASML has made clear over the past few months that it wants ‘something’ in advanced packaging. What exactly the Veldhoven-based company has in mind remains vague.
In various media outlets, ASML has been dropping hints about a future chip-bonding machine. The company has yet to announce a system that physically assembles chips or wafers. So far, it’s only delivered the XT260, a lithographic scanner designed to expose interposers – advanced substrates made of glass, silicon or ceramic onto which bare dies are mounted directly.
Last fall, ASML CEO Christophe Fouquet told Dutch newspaper NRC that his company has the capacity to explore new markets. What exactly he meant by that, he left unsaid.
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