Report: TSMC delves into rectangular chip substrates

TSMC is exploring the use of rectangular panels instead of traditional round wafers, Nikkei reports based on company sources. The panels, said to measure 510 by 515 millimeters, would fit many more chips per substrate not only because of their increased surface area but also because rectangular shapes fit rectangular chips more efficiently, with less unused area. As chips grow in size and complexity, traditional wafers may simply not cut it anymore.

As with any substrate size change, the transition would require a complete overhaul of equipment and facilities and present new challenges in processing and materials. TSMC “is working with equipment and material suppliers on the new method,” the Nikkei writes. Bernstein analyst Mark Li says it would take 5-10 years to commercialize the technology.

Interestingly, it was TSMC that pulled the plug on the development of 450-millimeter wafers a decade ago for fear of being crushed by then-market leader Intel. Larger wafer sizes are about “the big guys squeezing out the small guys. That’s the number one reason for going to the larger wafer sizes,” revealed former TSMC executive Chiang Shang-Yi in an interview with the Computer History Museum. By now, TSMC is top dog, but it might still require the support of Intel and Samsung before the likes of ASML will start developing panel-compatible equipment.