ALSI has been part of the ASM PT group for six years now. With a wealthy parent company like that, the machine builder from Beuningen has much more budget to spend on development and innovation. It recently launched new technology with which it hopes to make a bid for the memory mass market.
A few months back, just before the second wave arrived, Kees-Jan Leliveld, director of ASM Laser Separation International (ALSI), proudly shared a photo on Linkedin. The image showed his engineering team posing in front of a newly delivered machine for a South Korean customer. Not very special in itself, were it not for the fact that it’s based on new technology that should bring ALSI success in the years to come.
Like many machines from ALSI, the new Laser1205 system is also focused on grooving – a back-end chip production process that removes the brittle top layer from a freshly baked wafer, after which the dies can be sawn loose. A few years ago, ALSI got delayed in developing its 300 mm grooving platform, making it miss the window for the mass volume market. For the larger customers, competitor Disco often gets the order.
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