ASML expects the first products made using high-NA EUV lithography systems to appear within months, CEO Christophe Fouquet said on Tuesday at Imec’s ITF conference in Antwerp. He wasn’t specific whether it would be logic or memory chips (it could be both).
The announcement follows high-NA’s shift from R&D to production qualification earlier this year, meaning tools had been dialed in enough to start production test runs. “We continue to work to further mature the platform alongside our customers as they start to test the technology on product wafers and move closer to bringing high-NA into high-volume manufacturing,” Fouquet said in April, discussing Q1 2026 results.
The chips hinted at by Fouquet will therefore be most likely test chips. The insertion of high-NA EUV into high-volume manufacturing is expected in 2027 or 2028.
