BE Semiconductor Industries reported a sharp uptick in order intake for the first quarter of 2026, driven primarily by demand for hybrid-bonding systems and AI-related packaging. Orders reached 269.7 million euros, more than doubling year-on-year, while revenue rose to 184.9 million euros, up 28.3 percent, on strong shipments for high-end mobile and 2.5D AI computing applications.
Hybrid-bonding orders were a standout, with unit demand exceeding previous peaks and adoption expanding to twenty customers. “The outlook for hybrid-bonding adoption also improved with a series of new products and use cases announced this year for logic, memory, co-packaged optics and consumer applications. Such announcements indicate that the pace of hybrid-bonding adoption is increasing as we approach the timing for new AI-related product introductions anticipated in the 2027-2030 period,” comments CEO Richard Blickman.
Looking ahead, Besi forecasts revenue growth of 30-40 percent in the second quarter and “continued order momentum.”
