Photon Bridge and Phix have announced a partnership to accelerate the development and volume production of DWDM external laser source modules for AI data centers. The collaboration targets optical sub-assemblies for co-packaged optics and high-density interconnects, two key enablers of next-generation compute infrastructure. By combining photonic integration with advanced packaging, the companies aim to shorten the path from design to deployment.
Ever since Nvidia last year sounded the starting pistol, co-packaged optics is all the rage. To boost speed and reduce energy use, photons are set to replace electrons in increasingly shorter communication links, particularly in (AI) data centers. This will require integrating photonic circuits more intimately with electronic circuits. These systems will still require external light sources, and Photon Bridge is aiming to be a key supplier of those.
“The market needs a packaged, deployment-ready external laser source, and that’s exactly what we’re delivering,” says Photon Bridge chief commercial officer John Anderton. Photonics packaging foundry Phix adds manufacturing expertise, particularly in bridging prototype development to high-volume packaging. “Phix’s expertise and its model of developing packages to manufacturing readiness before transferring to volume production gives us a clear and reliable path to scale,” Anderton continues.
